SMT PCBAssembly , EMS Assembly Services, PCBA Products Manufacturer, PCBA Process - First Creation Industry

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BGA (ball grid array) assembly is totally compatible with soldering assembly technology. Chip-scale BGAs can have pitches of 0.5 mm, 0.65 mm or 0.8 mm, while plastic or ceramic BGA components feature wider pitches like 1.5 mm, 1.27 mm and 1 mm.
Fine-pitch BGA packages are more easily damaged than integrated circuits (ICs) with pin packages, and BGA components allow selective reduction of contact points to meet the specific requirement on I/O pins. As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Application of X-Ray Tomography in BGA Assembly
Most PCB manufacturers and electronics manufacturers haven’t noticed too much necessity to apply X-ray inspection in their manufacturing process until BGA components are applied in electronics assembly. Traditional inspection methods were regarded to be sufficient, such as manual visual inspection and electrical test, including manufacturing defect analysis (MDA), in-circuit test (ICT) and function test.


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